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Your search returned 20 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components And Packaging Technologies
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Year : 2002 Volume number : 25 Issue: 04 |
Enhanced Electronic System Reliability Challenges For Temperature Prediction
(Article)
Subject:
Physics Of Failure
,
Prediction
,
Reliability
,
Thermal
Author:
John O
Parry
Juha T
Rantala
page:
533
-
546
Measuring Partial Thermal Resistances In A Heat-Flow Path
(Article)
Subject:
Transient Thermal Loading
,
Thermal Transient Measurement
Author:
Marta
Rencz
Vladimir
Szekely
page:
547
-
553
Performance Characterization Of A Novel Flat Plate Micro Heat Pipe Spreader
(Article)
Subject:
Electronics
,
Micro Heat Pipe
,
Heat Spreading
Author:
Srikaran
Kalahasti
Yogendra K.
Joshi
page:
554
-
560
Dynamically Inserting Operating, Operating And Eliminating Thermal Sensors Of Fpga-Based Systems
(Article)
Subject:
Author:
A.
Lopez-Buedo
page:
561
-
566
Contributions From Thermal Challenges In Next Generation Electronic Systems (Thermes)
(Article)
Subject:
Electronic Systems
,
Contribution
Author:
page:
567
-
568
Thermal Challenges In Next Generation Electronic Ststems-Summary Of Panel Presentations And Discussions
(Article)
Subject:
Thermal Management
,
University Of Minnesota Engineer Explains What It Takes To Make
Author:
Suresh V.
Garimella
Yogendra K.
Joshi
C.-K.
Toh
page:
569
-
575
Thermal Issues In Mems And Microscale Systems
(Article)
Subject:
Microfluidics
,
Microhotplate
,
Thermal Applications
Author:
Don L.
Devoe
page:
576
-
583
Design And Optimization Of Air-Cooled Heat Sinks For Sustainable Development
(Article)
Subject:
Heat Sink
,
Least-Energy
,
Least-Mean-Square
Author:
Avram
Bar-Cohen
page:
584
-
591
Dynamics And Toplogy Optimzation Of Piezoelectric Fans
(Article)
Subject:
Piezoelectric Probe
,
Portable Fuel Cell
Author:
Suresh V.
Garimella
Philipp
Burmann
page:
592
-
600
Design And Performance Evaluation Of A Compact Thermosyphon
(Article)
Subject:
Dielectric Liquids
,
Electronic Cooling
Author:
A
Pal
Yogendra K.
Joshi
page:
601
-
607
Remote Heat Sink Concept For High Power Heat Rejection
(Article)
Subject:
Cooling Load
,
Heat Exchanger
,
Thermosyphon
Author:
Ralph L.
Webb
Shinobu
Yamauchi
page:
608
-
614
In-Plane Effective Thermal Conductivity Of Plain-Weave Kscreen Laminates
(Article)
Subject:
Plain Weave
,
Porosity
,
Screen
,
Thermal Conductivities
Author:
Jun
Xu
R. A
Wirtz
page:
615
-
620
Spreading In The Heat Sink Base Phase Change Systems Or Solid Metals
(Article)
Subject:
Boiling
,
Electronic Cooling
,
Heat Pipes
Author:
Loan
Sauciuc
R. L.
Mahajan
page:
621
-
628
Advanced Thermal Architecture For Cooling Of High Power Electronics
(Article)
Subject:
Chip To System Level
,
Electronics Cooling
,
Thermal Architecture
Author:
Zhi-Jun
Zuo
Wilfried
Philips
page:
629
-
634
Thermal Design Of A High-Density Server
(Article)
Subject:
High-Density Polyethylene Pipe
,
Itanium Processor
,
Radial Blower
Author:
David S.
De Lorenzo
page:
635
-
640
Effect Of Connection Design On The Contact Resistance Of High Power Overlapping Bolted Joints
(Article)
Subject:
Connectors
,
Contact
,
Overlapping
Author:
Milenko
Braunovic
page:
642
-
650
Transition From The Anodic Arc Phase To The Cathodic Metallic Arc Phase In Vacum At Low Dc Electrical Level
(Article)
Subject:
Anodic Arc
,
Arcing
,
Metallic Arc Phase
Author:
N. Ben
Jemaa
M
Morin
page:
651
-
655
Development Of Silver Zinc Oxide For General-Purpose Relays
(Article)
Subject:
Ac 1
,
Silver Cadmium Oxide
,
Silver Metal
Author:
Thomas J.
Schoepf
Volker
Behrens
page:
656
-
662
Fretting Corrosion And The Reliability Of Multicontact Connector Terminals
(Article)
Subject:
Connectors
,
Contact Resistance
,
Fretting Fatigue
Author:
Jonathan
Swingler
John W.
Mcbride
page:
670
-
676
Wire Bonding To Advanced Copper Low-K Integrated Circuits The Metal/Dielectric Stacks, And Materials
(Article)
Subject:
Author:
C. R
Harman
page:
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